半挠性印制板弯折能力研究

Research on Bending Ability of Semi-flexible Board

半挠性印制板作为刚挠结合板的一个分支,基于刚性多层板技术,使用可弯折的半挠性材料来制作,不需使用价格高昂的PI类挠性材料,能降低材料成本及加工难度,同时提供更好的组装密度。本文针对半挠性产品的特殊应用,对半挠性印制板的弯折能力进行研究及实验,分别研究半挠性区域宽度、线路密度、半挠性材料厚度、覆盖膜厚度等因素对半挠性印制板弯折能力的影响,通过工艺验证确认不同设计半挠性印制板弯折能力,为半挠性印制板制作提供加工依据,保证半挠性产品可靠性。

Semi-flexible printed circuit board,as a branch of rigid-flexible composite board,is made of flexible semi-flexible materials based on rigid multi-layer board technology,without using expensive PI flexible materials,which can reduce material cost and processing difficulty,and provide better assembly density.In this paper,aiming at the special application of semi-flexible products,the bending ability of semi-flexible printed boards is studied and experimented.The influences of the width of semi-flexible areas,circuit density,thickness of semi-flexible materials,thickness of covering film and other factors on the bending ability of semi-flexible printed boards are studied respectively.The bending ability of semi-flexible printed boards is improved through process optimization,which provides processing basis for the manufacture of semi-flexible printed boards and ensures the reliability of semi-flexible products.