基于模拟退火算法的功率元件热布局优化

Thermal Layout Optimization of Power Components Based on Simulated Annealing Algorithm

电子设备运行频率大幅提高,可能导致工作过程中功率元件由于温度过高而失效的问题,影响着电子机箱内部的正常工作。通过MATLAB编程实现模拟退火算法对PCB电子元件的散热布局进行优化设计,进而提高电子设备散热效率,并利用Icepak软件进行温度场仿真对温度结果进行验证。验证结果表明模拟退火算法可有效解决PCB电子元件散热布局的优化问题,避免了传统算法的大规模计算,在电子元件散热领域中有良好的应用前景,并且在实际应用中能有效改善温升问题,提高了电子设备的工作效率。

The operating frequency of electronic equipment is greatly increased,which may cause the failure of power components due to excessive temperature during the working process,and affects the normal operation of the electronic chassis.Simulated annealing algorithm was implemented by MATLAB programming to optimize the thermal layout of PCB electronic components and thus improve the thermal efficiency of electronic devices.The temperature results were verified by temperature field simulation using Icepak software.The validation results show that the simulated annealing algorithm can effectively solve the optimization problem of PCB electronic component heat dissipation layout,avoiding the large-scale calculation of traditional algorithms,and has good application prospects in the field of electronic component heat dissipation.The method can effectively improve the temperature rise problem in practical applications in order to improve the efficiency of electronic devices.