芯片超精密抛光用CMP抛光垫研究进展

Research Progress on CMP Polishing Pads for Ultra Precision Polishing of Chips

化学机械抛光(CMP)技术是集成电路制造过程中实现晶圆表面平坦化的关键工艺,抛光垫是CMP工艺的关键原材料和耗材。本文从抛光垫的分类、基体材料、结构、作用、自修复及再生、制备工艺等方面进行了相关的综述。对目前抛光垫的研究中存在的问题及发展前景进行了展望。

Chemical mechanical polishing(CMP)technology is a key process for achieving wafer surface flatness in integrated circuit manufacturing,and polishing pads are key raw materials and consumables for the CMP process.This article provides a comprehensive review on the classification,matrix material,structure,function,self-healing and regeneration,and preparation process of polishing pads.The existing problems and development prospects of the current research on polishing pads are discussed.