HIC有机密封材料温升实验及模拟验证

The Temperature Rise Experiment and Simulation Verification of Organic Sealing Material of HIC

混凝土高完整性容器(HIC)技术的应用极大的提高了核电厂放射性固体废物最小化的水平,而HIC的密封工艺一直是该领域的研究重点。本文选择环氧树脂E-51作为有机密封材料开展了一系列研究,通过试验与模拟结合的方法,探究了环氧树脂在固化过程中的温度变化规律,对其在一定体积下的最大释热功率进行了拟合,并将该释热功率代入HIC模型中进行模拟。结果表明,在室温条件下环氧树脂可作为一种良好的HIC密封材料使用。

The application of concrete high integrity container(HIC)technology has greatly improved the level of radioactive solid waste minimization in nuclear power plants,and the sealing process of HIC has been the focus of research in this field.In this paper,epoxy resin E-51 was selected as the organic sealing material to carry out a series of studies.Through the combination of test and simulation,the temperature variation law of epoxy resin during the curing process was explored,and its maximum heat release power under a certain volume was fitted,and the heat release power was substituted into the HIC model for simulation.The results show that epoxy resin can be used as a good HIC sealing material at room temperature.