无芯封装基板应力分析与结构优化

Stress Analysis and Structural Optimization of Coreless Package Substrates

封装基板作为集成电路的载体,可以实现芯片的电连接、支撑保护及散热等。因此,封装基板的可靠性至关重要。在封装基板的加工过程中,热、机械等因素如铜含量分布不均衡、材料的热膨胀系数(CTE)不匹配等均可能导致基板出现翘曲、开裂等现象,进而导致基板出现短路、断路,从而影响元器件的功能。采用有限元分析法,对无芯封装基板在加工过程中所经历的热、机械情况进行模拟,分析了基板设计对基板翘曲、应力分布的影响。通过对基板设计进行优化改进、仿真验证、样品加工验证,无芯基板加工过程中的断裂现象得到显著改善。

Package substrates as the carriers of the integrated circuits,can realize the electrical connection,support protection and heat dissipation of chips.Therefore,the reliability of package substrates is very crucial.In the processing of package substrates,thermal and mechanical factors such as uneven distribution of copper content and mismatch in the coefficient of thermal expansion(CTE)of the materials may lead to warping,cracking and other phenomena of the substrates,which will lead to short circuits and open circuits of the substrates,thus affecting the functions of the components.Finite element analysis method is used to simulate the thermal and mechanical conditions experienced by the coreless package substrates during processing,and the influence of substrate design on substrate warping and stress distribution is analyzed.Through optimization and improvement of the substrate design,simulation verification and sample processing verification,the fracture phenomenon during the processing of coreless substrates has been significantly improved.