晶圆卡盘热力耦合分析

Analysis on Thermo-mechanical Coupling of Wafer Chuck

晶圆卡盘是晶圆加工中常用的夹持装置,具有精度高、吸附力大、夹持平稳的特点。工作时,晶圆卡盘一般处于热力耦合的环境中,引起的变形和受力难以预知和理论分析。总结了热力耦合仿真流程,回顾了热力耦合理论,并对某型键合设备中使用的TC4晶圆卡盘进行了热载荷单独作用、外载荷单独作用、热力耦合作用的对比仿真研究。同时,针对结果进行了优化分析,为后续改进提供参考。

Wafer chuck is a commonly used clamping device in wafer processing,which has the characteristics of high presicion,large adsorption force and stable clamping.When working,wafer chucks are generally in a thermally coupled environment,the deformation and stress caused by them are difficult to predict and theoretically analyze.The process of thermal coupling simulation is summarized,the theory of thermal coupling is reviewed.Comparative simulation studies is conducted on the TC4 wafer chuck used in a certain type of chip bonding equipment,including thermal load alone,external load alone,and thermal coupling.At the same time,optimization analysis is conducted on the results to provide reference for subsequent improvements.