液相下激光烧蚀快速制备图案化铜微纳结构

Rapid fabrication of patterned Cu micro-nano structure by laser ablation in liquid

为了实现大面积图案化铜微纳结构的制备,基于液相下激光烧蚀技术,以硅片为衬底,将其浸没在含有Cu2O微米粒子的乙醇溶液中,采用纳秒脉冲激光进行加工。研究了激光功率、扫描速度和扫描次数对铜微纳结构的影响,分析了图案化铜微纳结构的形成机制,并研究了图案化铜微纳结构的浸润特性。扫描电子显微镜结果表明,随着激光功率、扫描速度和扫描次数的增加,图案化铜微纳结构中的铜颗粒熔融现象加剧,光斑中心区域的纳米颗粒粒径逐渐增大,光斑交界处形成呈现周期性分布的微米量级单元结构。能量色散X射线光谱证明少量Cu元素分布在光斑中心区域,大量Cu元素集中在光斑交界处。随着扫描次数的增加,样品表面粗糙度和纯净水/食用油接触角均呈现先上升后下降的趋势。当扫描次数为6时,表面平均粗糙度为(1.3±0.11)μm,纯净水接触角可达(155.2±1.5)°,食用油接触角达(100.0±1.3)°。该大面积图案化铜微纳结构制备方法简单快速,无粉尘污染,在微流体芯片、集水系统和废水处理等领域具有广泛的应用前景。

A large-scale patterned Cu micro-nano structure was prepared via laser ablation technology in liquid.A Si wafer was used as the substrate,which was immersed in an ethanol solution containing Cu2O microparticles and processed by a nanosecond pulsed laser.The effects of the laser power,scanning speed,and number of scans on the Cu micro-nano structure in liquid,the formation mechanism of the pat⁃terned Cu micro-nano structure,and the wetting characteristics of the patterned Cu micro-nano structure were analyzed.The results of scanning electron microscopy indicated that with increases in the laser power,scanning speed,and scanning time,the melting of Cu particles in the patterned Cu micro/nanostruc⁃ture intensified,the particle size of nanoparticles in the center of the laser spot increased,and a micron unit structure was formed at the junction of the laser spot,exhibiting a periodic distribution.Energy-dispersive X-ray spectroscopy confirmed that a small amount of Cu was distributed in the central region of the spot,and a large amount of Cu was concentrated at the junction of the spot.In addition,both the surface rough⁃ness and static contact angle of the sample increased with the number of scans.When the number of scans was 6,the average surface roughness,water contact angle,and oil contact angle are(1.3±0.11)μm,(155.2±1.5)°,and(100.0±1.3)°,respectively.The proposed simple and rapid preparation method for large-area patterned Cu micro/nano structures has wide application prospects in the fields of microfluidic chips,water-collection systems,and wastewater treatment.