超声振动辅助抛光材料去除机理研究

Study on Material Removal Mechanism of Ultrasonic Vibration-assisted Polishing

超声振动辅助抛光是一种特种精密加工方法,其材料去除过程包含机械、物理、化学等多种因素,研究材料去除机理具有重要意义。对超声流场及超声流场作用下单颗磨粒对工件表面冲击作用进行仿真,分析超声流场作用下抛光过程的材料去除机理。仿真分析表明,在超声作用下,流场产生极强的横向剪切流,横向剪切流携裹着磨粒对工件表面产生冲击作用,从而实现材料去除。材料去除量与磨粒冲击角有关,磨粒冲击角越大,材料去除量越大。随着抛光的进行,工件表面逐渐趋于平整,磨粒冲击角也随之减小,逐渐趋于0°,此时不再有材料去除,工件抛光完成。

Ultrasonic vibration-assisted polishing is a special precision processing method,and its material removal process includes mechanical,physical,chemical and other factors,and it is of great significance to study the material removal mechanism.The ultrasonic flow field and the impact of a single abrasive on the surface of the workpiece under the action of the ultrasonic flow field were simulated,and the material removal mechanism of the polishing process under the action of the ultrasonic flow field was analyzed.The simulation analysis shows that under the action of the ultrasound,the flow field produces a strong transverse shear flow,and the abrasive carried by transverse shear flow has an impact effect on the surface of the workpiece,thereby realizing the removal of material.The amount of material removed is related to the abrasive impact angle,and the larger the abrasive impact angle,the greater the amount of material removed.With the polishing,the surface of the workpiece gradually tends to be flat,and the abrasive impact angle also decreases,gradually tending to O°,at this time,there is no longer material removal,and the workpiece polishing is completed.