5LJUNGBERG K,JANSSON U,BENGTSSON S,et al.Modification of silicon surface with H2SO4:H2O2:HF and HNO3:HF for wafer bonding applications.[J]Electrochem.Soc,1996,143(5):1709-1714.
6MOUCHE L,TARDIF F,DERRIEN J.Particle deposition on silicon wafers during wet processes[J].Electrochem Soc,1994.141(6):1684-1691.