HDI板铜箔压合剥离强度探讨

Discussion on the strength of copper foil compression and stripping of HDI

随着智能电子产品向轻薄化及多功能化发展,高阶高密度互连板(HDI)12层及以上产品对铜箔剥离强度要求越来越高。铜箔剥离强度在印制电路板(PCB)层压前后变化不大,因此铜箔的剥离强度是影响PCB剥离强度的关键因素。选取A、B、C、D四种不同的铜箔进行对比测试。研究结果表明:剥离强度与设备及压合位置无关,与材料本身及设计强相关。

The trend of intelligent electronic products towards lightness,thinness and versatility.High order high density interconnect(HDI)board products with 12 layers and above have requirements for copper foil stripping strength.The stripping strength of copper foil does not change much before and after the lamination of printed circuit boards,so the stripping strength of copper foil is the key factor affecting the stripping strength of PCBs.Now,comparative tests are conducted on four different types of copper foils A,B,C,and D.The research results show that the stripping strength is not related to the equipment or the pressing position,but strongly related to the material itself and design.