半导体装备工程化批产脉动生产线技术应用与研究

Research and Application of Semiconductor Equipment Engineering Batch Production Pulsation Production Line Technology

国产半导体装备在国家政策及国内市场的双重推动下迎来了新发展机遇,未来设备交货能力将成为半导体工艺设备厂商竞争的重点,为进一步提高设备出货及市场交货能力,加强企业竞争力,通过脉动生产线技术应用,使得国产半导体装备工程化批产能力建设进一步得到加强,目前该生产线年产能180台套装备,其中200 mm(8英寸)立式炉、150 mm(6英寸)SiC外延设备等半导体装备已实现研转批工程化批产生产。该技术在半导体设备制造过程中具有重要的应用价值,可以有效提高生产效率和产品质量。然而,目前该技术在实际应用中还存在一些问题,需要进一步研究和改进。希望本文的研究成果对相关领域的研究者和实践者有所启示和借鉴。

Under the dual promotion of national policies and the domestic market,domestic semiconductor equipment has encountered new development opportunities.In the future,equipment delivery capability will become a key competition point for semiconductor process equipment manufacturers.In order to further improve equipment delivery and market capability,strengthen enterprise competitiveness,and enhance the capacity building of domestic semiconductor equipment by application of the pulsation production line technology,the current production line has an annual capacity of 180 sets of equipment.Among them,200 mm(8-inch)vertical furnaces,150 mm(6-inch)SiC epitaxial equipment,and other semiconductor equipment have achieved research-to-production.This technology has significant application value in the semiconductor equipment manufacturing process and can effectively improve production efficiency and product quality.However,there are still some issues in the practical application of this technology that need further research and improvement.It is hoped that the research results of this paper can provide inspiration and reference for researchers and practitioners in related fields.