6HAUHE MS, WOOLDRIDGE J J. High density pack- aging of X-band active array modules[J]. IEEE Trans- action Components, Packaging, and Manufacturing Technology, 1997,4(3) :672 - 679.
7DAISUKE U,TAKESHI F,SHUICHI N,et al. Pres- ent and future of GaN power devices[C]//Intergrated Power Systems, 8th International Conference. Nurem- berg,Germany, 2014 : 25 - 27.
8SCHUH P, SLEDZIK H, REBER R, et al. GaN MMIC based T/R-module front-end for X-band applications [C]//European Microwave Integrated Circuits Confer- ence Proceedings, 2008 : 274 - 277.
9BOUTROS K,CHU R, HUGHES B, et al. Recent ad- vances in GaN power electronics[C]//Custom Inte- grated Circuits Conference, 2013 : 22 - 25.