导热吸波材料研究进展

Research progress of thermally conductive microwave-absorbing materials

针对电子和通讯设备小型化、高度集成化带来的散热和电磁兼容困难问题,本文分析了导热吸波材料的发展现状,从单一的导热功能材料和吸波功能材料的设计制备出发,归纳了导热机理与吸波机理以及影响导热和吸波性能的重要因素。在此基础上介绍了一些典型的提高导热吸波综合性能的方法及其设计制备方法,在总结现有导热吸波复合材料的发展现状和问题的基础上,考虑当前技术的不足,提出了未来导热吸波材料的发展方向,包括制备高热导率的聚合物基体材料、结构优化设计和增强导热吸波复合材料综合性能的研究。通过此研究,旨在为制备高性能导热吸波材料提供参考,提升行业技术水平,开发出兼具高导热和电磁波吸收功能的新型复合材料。

This study analyzes the development status of thermally conductive and absorptive materials to address the challenges of heat dissipation and electromagnetic compatibility in miniaturized and highly integrated electronic and communication devices.Starting from the design and fabrication of single thermally conductive and absorptive functional materials,the paper describes the thermal conduction mechanism,absorptive mechanism,and important factors influencing thermal conduction and absorption performance.Furthermore,various typical methods and their design and fabrication approaches to enhance the comprehensive performance of thermal conduction and absorption are presented.On the basis of the summary of the current development status and issues of thermally conductive and absorptive composite materials,the future directions for these materials are proposed,including the preparation of polymer matrix materials with high thermal conductivity,structural optimization design,and research on enhancing the comprehensive performance of thermally conductive and absorptive composites.This research aims to provide references for the preparation of high-performance thermally conductive and absorptive materials,elevate technological standards of the industry,and develop novel composite materials with high thermal conductivity and electromagnetic wave absorption capabilities.