玻璃在5G通讯中的应用

Glass for 5G applications

第五代无线通信技术(5G)具有最高可达10 Gb/s传输速率、1000倍于现有技术的超大网络容量以及毫秒级的超短时延,从而可以实现各种新颖和复杂的应用。5G技术要求所使用的器件具有更大带宽、更高频率和更紧凑的尺寸等特征。介绍了玻璃在功率器件中对元器件的保护;阐述了玻璃作为粘结相在电极浆料中发挥的焊接作用;总结了玻璃作为新型基板在毫米波器件中的应用,以及以玻璃基板为基础的封装技术;概括了玻璃作为增强材料在5G PCB基板生产中的应用,并对商用玻璃纤维发展方向进行了展望;指出了未来玻璃在器件小型化、集成化所能发挥的作用,并对玻璃在通讯器件中的应用前景和发展方向进行了总结与展望。

5G telecommunication has transmission speeds of up to 10 Gb/s,massive network capacity(1000 times that of present technologies),and ultra-short latency in the millisecond range,enabling a variety of novel and complicated applications.5G technology requires the used equipment have enhanced bandwidth,higher frequencies,and more compact dimensions.Glass,as a protective layer for components in power devices,is described as a soldering phase in electrode pastes.The application of glass as a new substrate are reviewed for glass substrate-based mm-wave devices and the packaging technology.Glass is also used as a reinforcing material in the production of 5G PCB substrates.The direction is discussed for the commercial glass fiber development.The potential and possible development are summarized for using glass in communication devices,where glass may play a role in device miniaturization and integration.