摘要
阐述机电一体化装配过程的现状和发展趋势,探讨物联网技术、人工智能技术、云计算技术和大数据技术等智能化技术在机电一体化装配过程中的应用。
This paper describes the current situation and development trend of electromechanical integration assembly process, and discusses the application of intelligent technologies such as Internet of Things technology, artificial intelligence technology, cloud computing technology and Big data technology in electromechanical integration assembly process.
作者
杨亚莉
YANG Yali(Anshun Vocational and Technical College,Guizhou 561000,China)
出处
《集成电路应用》
2023年第7期340-341,共2页
Application of IC
关键词
机电一体化
装配过程
智能化技术
物联网
mechatronics integration
assembly process
intelligent technology
IoT