江苏省第三代半导体与智能化产业融通创新发展路径

The Innovative Development Path of the Integration of the Third Generation Semiconductor and Intelligent Industry in Jiangsu Province

当前,能源技术革命已从高端电力装备创新逐步转向材料技术革命。以SiC和GaN为主的第三代半导体材料与技术对于建成高效、可靠且可循环的能源网络至关重要。然而,由于产业、技术、市场和资本之间存在长期的信息不对称,以及国内下游智能化产业对上游供应链的不信任,导致创新成果难以落地、创新主体抗风险能力较弱,第三代半导体领域国产化进程频频受阻。通过构建“技术成熟度/专利价值”融通创新发展模型,围绕全球第三代半导体SiC与GaN细分技术领域全生命周期,结合江苏省产业发展实际,提出产业、资本及平台间的融通创新发展路径,以更好促进纵向产业链、横向产学研及大中小企业融通创新发展。结合江苏第三代半导体与智能化产业发展实际,从创新生态构建、核心技术攻关、协同创新平台、IDM(垂直整合制造)运营、专利运营、市场监管、人才梯队培养等7个方面,提出对策及建议。

At present,the energy technology revolution as gradually shifted from high-end power equipment innovation to material technology evolution.It is very important to build an efficient,reliable and recyclable energy network by the third generation semiconductor materials and technologies based on SiC and GaN are very important.However,due to the long-term information asymmetry between industry,technology,market and capital,as well as the distrust of domestic downstream intelligent industries on the upstream supply chain,it is difficult to implement innovation achievements,the anti risk ability of innovation subjects is weak,and the localization process in the field of third-generation semiconductors is frequently blocked.By constructing the“technology maturity/patent value”financing innovation development model,focusing on the whole life cycle of the global third-generation semiconductor SiC and GaN subdivision technology field,and combined with the actual industrial development of Jiangsu Province,the financing innovation development path among industry,capital and platform is put forward,so as to better promote the vertical industrial chain Horizontal industry university research and financing and innovative development of large,medium and small enterprises.Combined with the development reality of the third generation semiconductor and intelligent industry in Jiangsu,countermeasures and suggestions are put forward from seven aspects:innovation ecological construction,core technology research,collaborative innovation platform,IDM operation,patent operation,market supervision and talent echelon training.