基于Sn-3Ag-Nb/Cu界面反应的综合实验教学改革与实践

Reform and Practice on Comprehensive Experimental Teaching Based on Sn-3Ag-Nb/Cu Interface Reaction

依托科研项目和《材料科学基础》课程知识点设计了基于Sn-3Ag-Nb/Cu界面化学反应的综合教学实验。利用扫面电镜等设备表征焊接界面结果如下:界面IMC晶粒直径、厚度生长均与时间的1/3次方成正比。在高压空气吹扫、水冷、空冷、炉冷条件下,界面IMC形貌依次为扇贝状、棱柱状、六棱柱状。通过前期文献查阅、实验过程探索和实验结果分析,该实验教学有助于学生理论联系实践,并加深学生对界面化学反应的理解,提升学生的创新思维和实践动手能力。

A comprehensive experimental of Sn-3Ag Nb/Cu interface chemical reaction was designed by basing on scientific research projects and the knowledge points of the course of Fundamentals of Materials Science.The results of characterizing the soldering interface using scanning electron microscopy and other equipment were as follows:the growth of IMC grain diameter and thickness at the interface was proportional to the 1/3 power law of time.Under high-pressure air,water cooling,air cooling and furnace cooling conditions,the interface IMC morphology was scallop-shaped,prismatic,and hexagonal prismatic in sequence.Through preliminary literature review,exploration of the experimental process and analysis of experimental results,this experimental teaching helped students connect theory with practice,their understanding of interface chemical reactions was deepened,and their innovative thinking and practical abilities was enhanced.