新型工艺处理半导体行业废水工程实例

Example of a New Process for Treating Semiconductor Industry Wastewater Engineering

半导体行业作为芯片的唯一来源,生产制造过程中废水的处理问题日益加剧,特别是多种废水处理工艺。以江苏无锡某新建6寸、12寸半导体生产制造及GaAs封测项目为例进行工艺研究,针对其系统含氟废水、氨氮废水、有机废水、酸碱废水和重金属废水等采用加药化混沉淀法、短程硝化+新型厌氧氨氧化、混凝沉淀法等工艺使其出水满足排放标准。旨在为半导体行业混合废水处理提供参考,以供同行之间学习交流。

As the only source of chips,the semiconductor industry is facing increasingly severe wastewater treatment problems in the production and manufacturing process,especially in various wastewater treatment processes.Taking a newly built 6-inch and 12-inch semiconductor manufacturing and GaAs sealing project in Wuxi,Jiangsu Province as an example,process research was conducted.For its system containing fluoride wastewater,ammonia nitrogen wastewater,organic wastewater,acid alkali wastewater,and heavy metal wastewater,processes such as dosing coagulation sedimentation method,short range nitrification+new anaerobic ammonia oxidation,coagulation sedimentation method were used to ensure that the effluent meets the discharge standards,providing reference for the treatment of mixed wastewater in the semiconductor industry for peer learning and exchange.