微带线焊点温度疲劳寿命预测分析

Prediction Analysis for Thermal Fatigue Lifetime of Microstrip Wire Solder Joint

为解决机载雷达微波组件微带线焊点寿命评估问题,基于Norris-Landzberg寿命模型开展了研究分析,通过引入两种不同的模型参数进行了焊点温度疲劳寿命预测。采用新状态和已在实际工作条件下使用过的旧状态两种微带线焊点,对比进行温度加速寿命试验,结合试验结果进行实际工作条件下焊点温度疲劳寿命预测。结果表明,运用两种模型参数构建的预测模型,均适用于微带线焊点温度疲劳寿命预测,对焊点疲劳寿命研究工作具有一定参考价值。

In order to solve the problem of lifetime evaluation for microstrip wire solder joints of airborne radar microwave components,the research and analysis is carried out based on the Norris-Landzberg model,and solder joint thermal fatigue lifetime is predicted by introducing two different model parameters.Temperature accelerated life tests are conducted with microstrip wire solder joints in both new and old states,combined with the test results,the thermal fatigue lifetime prediction of solder joints under actual working conditions is carried out.The results show that the prediction model constructed by using two model parameters are both suitable for thermal fatigue lifetime prediction of microstrip wire solder joints,and has certain reference value for the fatigue lifetime research of solder joints.