CCGA器件焊接工艺及可靠性研究

Research on Welding Process and Reliability of CCGA Device

陶瓷柱栅阵列封装器件(CCGA)由于其抗振、易清洗、热匹配性好等优势,在可靠性要求较高的航天电子产品中被大量选用。为了满足航天产品应用需求,本文通过对CCGA器件焊接工艺及可靠性研究,摸索一条CCGA器件焊接工艺流程,并确定适宜的焊接工艺参数,包括制备试件,开展了验证试验和可靠性分析。根据分析结果调整工艺流程及参数,最终研究出一条CCGA器件与PCB印制板可靠焊接的工艺路线。

Column ceramic gray array packaging devices are widely used in aerospace electronic products with high reliability because of its advantages of vibration resistance,easy cleaning and good thermal matching.In order to meet the application requirements of aerospace products,this paper studies the welding process and reliability of CCGA devices,explores a welding process flow of CCGA devices,determines appropriate welding process parameters,prepares specimens,carry out verification test and reliability analysis on the specimens.According to the analysis results,the process flow and parameters are adjusted,and finally the route of reliable welding process between CCGA device and PCB is determined.