引线键合弹坑试验方法和可靠性研究

Wire bonding crater test method and reliability study

本文分析了集成电路封装引线键合工艺中弹坑的危害与试验原理,总结了弹坑试验的具体流程,和试验方法。针对不同芯片焊盘(Pad)结构的弹坑试验进行了研究和分析、对比,总结出了正确、高效、安全的试验方法,可以有效避免质量检测时对弹坑的误判,提高质量检测效率。采用切片的方法分析了芯片Pad结构及弹坑缺陷的程度,用回流焊、温循试验、高压蒸煮与功能测试的方法验证了不同芯片Pad结构的弹坑对产品可靠性的影响,并通过生产跟踪证实了所述方法的有效性。

This paper analyzes the hazards and test principles of cratering in IC packaging Wire bonding process,and summarizes the specific process of cratering test,and test methods.The crater test for different chip pad structures is studied,analyzed,compared,and a correct,efficient and safe test method is concluded,which can effectively avoid misjudgment of craters during quality inspection and improve the efficiency of quality inspection.The chip Pad structure and the degree of crater defects are analyzed by X-section method,and the impact of craters on product reliability of different chip Pad structures is verified by reflow,temperature cycling test,high pressure cooking and functional test,and the effectiveness of the described method is confirmed by production tracking.