浅析等离子清洗对集成电路塑封空洞异常的影响

Analysis of the Influence of Plasma Cleaning to the Molding Void in Integrated Circuit

本文介绍了塑封料与引线框架的粘接强度以及等离子清洗工艺的基本原理,通过等离子清洗实验,浅析了多次等离子清洗对塑封产生空洞异常的影响,分析结论对提高产品的封装可靠性提供了相应的参考依据。

This paper introduces the bonding strength between the EMC and the lead frame and the basic principle of the plasma cleaning process.Through the plasma cleaning experiment,the influence of multiple plasma cleanings on the abnormal cavity generation in the molding is briefly analyzed.The analysis conclusion provides a corresponding reference for improving the packaging reliability of the product.