半加成工艺中薄化铜后烘烤对剥离强度的影响

Effect of Baking After Electroless Cu Plating on Peel Strength in Semi-Additive Process

近年来,半加成法成为了一种新的印制电路板的线路制作工艺,但其存在树脂与铜箔间的剥离强度不高的问题。通过拉力测试以及扫描电子显微镜、红外光谱、X射线光电子能谱(XPS)的表征,探究了BT树脂基板在薄化铜后进行烘烤对树脂剥离强度的影响。研究结果表明,板材的失效模式是树脂的内聚破坏,经过烘烤后树脂与增强颗粒间的结合力下降,树脂本身会受到铜离子催化氧化的影响,结构发生改变,导致强度降低。对失效机理的研究为半加成法提供了改进思路。

In recent years,the semi-additive process has become a new circuit manufacturing process for printed circuit boards,but it has the problem of low peel strength between resin and copper foil.The influence of baking BT resin substrate on the peel strength after electroless Cu plating is explored through tensile testing,scanning electron microscopy,infrared spectroscopy,and X-ray photoelectron spectroscopy(XPS).The results show that the failure mode of the plate is the cohesion failure of the resin,the adhesion between the resin and the reinforcing particles decreases after baking,and the resin itself will be affected by the catalytic oxidation of copper ions,which changes the structure and reduces the strength.Through the study of the failure mechanism,it can provide improvement ideas for the semi-additive process.