激光烧结纳米铜膏成型线路的清洗工艺研究

Research on Cleaning Process of Forming Circuits of Laser Sintering Nano Copper Paste

提出了一种基于紫外纳秒脉冲激光的纳米铜膏(铜的质量分数为85%)选择性烧结成型线路技术。采用乙醇超声清洗技术对成型线路进行清洗,剥离未烧结区的纳米铜膏。采用质量分数为30%的双氧水和质量分数为5%的硫酸,通过氧化酸洗技术去除热烧结区的纳米铜膏,从而获得纳米铜中心烧结区的成型线路。通过场发射扫描电子显微镜(SEM)和能谱色散型光谱仪(EDS)进行表征,证明清洗后的成型线路表面主要为金属铜,表层的纳米铜颗粒完全相融连接。该方法为激光烧结成型线路的清洗提供了参考。

A selective sintering forming circuit technology for nano copper paste(with a mass fraction of 85%copper)based on ultraviolet nanosecond pulse laser is proposed.The forming circuits are cleaned by ethanol ultrasonic cleaning technology,and the nano copper paste in the unsintered area is stripped.Hydrogen peroxide with a mass fraction of 30%and sulfuric acid with a mass fraction of 5%are used to remove nanometer copper paste in hot sintering area by oxidation pickling technology,and the forming circuits in the center sintered area of nano copper are obtained.Characterization by field emission scanning electron microscopy(SEM)and energy dispersive spectroscopy(EDS)demonstrates that the cleaned surface of the forming circuit is mainly composed of metallic copper,and the nano copper particles on the surface are completely fused and connected.This method provides a reference for the cleaning of laser sintering forming circuits.