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Introducing oxygen vacancies in TiO_(2) lattice through trivalent iron to enhance the photocatalytic removal of indoor NO 被引量:1

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摘要 The synthesis of oxygen vacancies(OVs)-modified TiO_(2)under mild conditions is attractive.In this work,OVs were easily introduced in TiO_(2)lattice during the hydrothermal doping process of trivalent iron ions.Theoretical calculations based on a novel charge-compensation structure model were employed with experimental methods to reveal the intrinsic photocatalytic mechanism of Fe-doped TiO_(2)(Fe-TiO_(2)).The OVs formation energy in Fe-TiO_(2)(1.12 eV)was only 23.6%of that in TiO_(2)(4.74 eV),explaining why Fe^(3+)doping could introduce OVs in the TiO_(2)lattice.The calculation results also indicated that impurity states introduced by Fe^(3+)and OVs enhanced the light absorption activity of TiO_(2).Additionally,charge carrier transport was investigated through the carrier lifetime and relative mass.The carrier lifetime of Fe-TiO_(2)(4.00,4.10,and 3.34 ns for 1at%,2at%,and 3at%doping contents,respectively)was longer than that of undoped TiO_(2)(3.22 ns),indicating that Fe^(3+) and OVs could promote charge carrier separation,which can be attributed to the larger relative effective mass of electrons and holes.Herein,Fe-TiO_(2)has higher photocatalytic indoor NO removal activity compared with other photocatalysts because it has strong light absorption activity and high carrier separation efficiency.
出处 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2023年第10期2025-2035,共11页 矿物冶金与材料学报(英文版)
基金 supported by the BJAST High-level Innovation Team Program (No.BGS202001) the Beijing Postdoctoral Research Foundation (No.2022-ZZ-046) the National Natural and Science Foundation of China (No.51972026) the Japan Society for the Promotion of Science (JSPS)Grant-in-Aid for the Scientific Research (KAKENHI,Nos.16H06439 and 20H00297) the Dynamic Alliance for Open Innovations Bridging Human,Environment and Materials,the Cooperative Research Program of“Network Joint Research Center for Materials and Devices.” the scholarship granted to a visiting Ph.D.student of the Inter-University Exchange Project by the China Scholarship Council (CSC,No.201906460113)。
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