日本政府对日美半导体摩擦问题处理过程的历史考察——以《日美半导体协议》为中心

A Historical Investigation on the Japanese Government's Handling the Semiconductor Friction between Japan and the United States

为了解决两国间愈演愈烈的半导体摩擦问题,日美两国政府经过磋商谈判最终于1986年9月2日签订《日美半导体协议》。双方对于协议条款理解上的分歧大致可以概括为美方强调“结果的达成”,而日方更注重过程或“义务的履行”。美国政府利用协议所带来的法理基础,通过对日本半导体产品征收报复性关税来迫使日本政府在“数值目标”等问题上让步,把控了日美半导体摩擦问题的处理方向。协议的“失效”不仅直接影响了日本半导体产业的发展,更促使日本政府思考、调整应对双边贸易摩擦问题的处理方式。

The Japan-U.S.Semiconductor Agreement was a bilateral agreement signed by the governments of Japan and the United States on September 2,1986 to solve the growing semiconductor friction between the two countries.The difference in the understanding of the terms of the agreement can be roughly summarized as followed:the United States emphasized"the achievement of results",while the Japanese side paid more attention to the process or"the implementation of obligations".The U.S.government took advantage of the agreement to force the Japanese government to make concessions on issues such as"numerical targets"by imposing retaliatory tariffs on Japanese semiconductor products,and controlled the negotiation direction of the Japan-US semiconductor friction issue.The"lapse"of the agreement not only directly affected the development of Japan's semiconductor industry,but also forced the Japanese government to consider and adjust the way to deal with trade frictions.