微观定向结构Cu-W复合材料触头弹跳特性分析

Analysis on Bounce Characteristics of Cu-W Composite Contact with Micro-Oriented Structure

以商用无序结构Cu-W触头及3种微观定向结构Cu-W复合材料触头为研究对象,建立接触器触头弹跳动力学模型、电磁模型以及触头力学模型,实现接触器机电磁多物理场耦合仿真分析,研究3种微观定向结构和商用无序结构Cu-W触头承受载荷后的应力、应变差异,以及对触头弹跳的影响。最后,通过试验验证,发现微观定向结构触头的弹跳幅值更小,弹跳时间更短。结果表明微观定向结构Cu-W复合材料触头对比商用无序结构Cu-W触头具有良好的抗弹跳特性,其中菱形十二面体骨架结构Cu-W触头抗弹跳特性最优。

The commercial disordered structure Cu-W contact and three kinds of micro-oriented Cu-W composite contacts were taken as the research object.Through the establishment of contactor contact bounce dynamics model,the electromagnetic model and the contact mechanics model,the machine-electric-magnetic multi-physics coupling simulation analysis of the contactor was implemented.The stress-strain difference of the three micro-oriented structure and commercial disordered structure Cu-W contact under load was studied.The influence of the three micro-oriented structure and commercial disordered structure Cu-W contact on contact bounce was analized and verified through experiment.The micro-oriented structure contact was found to have smaller bounce amplitudes and shorter bounce times.The results show that compared with commercial disordered structure Cu-W contacts,the micro-oriented Cu-W composite contacts have better bounce resistance,and Cu-W contact with the rhombic dodecahedron frame structure possess the best anti-bounce characteristics.