KMnO_(4)-NaOH体系对环氧树脂基板表面的微蚀效果

Etching of epoxy resin in KMnO_(4)-NaOH solution

采用环境友好的KMnO_(4)-NaOH微蚀体系对环氧树脂(EP)基板进行表面处理,通过考察EP基板表面的微观形貌、水接触角、粗糙度、含碳基团含量及化学镀铜层剥离强度,研究了氢氧化钠质量浓度及微蚀时间对微蚀效果的影响。结果表明:在60℃的70 g/L KMnO_(4)微蚀体系中,当NaOH为40 g/L时,微蚀处理25 min后EP基板表面水接触角由微蚀处理前的94.6°降至32.9°,EP基板表面呈现强的亲水性,并且生成了大量致密均匀的微孔,令EP基板表面的粗糙度增大,其平均粗糙度Ra为238nm,均方根粗糙度Rq为293nm。在强的表面亲水性和高表面粗糙度的共同作用下,EP基板与化学镀铜层之间的剥离强度得到了提高,最大达到8.1 N/cm。

The etching of epoxy(EP)resin was conducted in an environmentally friendly solution comprising KMnO_(4) and NaOH.The effects of the NaOH mass concentration and etching time on the morphology,water contact angle,and roughness of EP resin surface,and the contents of different carbon-containing groups and adhesion of copper coating plated electrolessly on the etched EP resin were studied.The results showed that the water contact angle of EP resin was decreased from 94.6°to 32.9°after etching with KMnO_(4)70 g/L and NaOH 40 g/L at 60℃ for 25 min,indicating that the etched EP resin had a strong hydrophilicity.A large number of micropores appeared on the surface of etched EP resin,increasing the surface roughness of EP resin.The arithmetic average roughness Ra and root mean square roughness Rq of the etched EP resin surface were 238 nm and 293 nm,respectively.Due to the strong surface hydrophilicity and high surface roughness,the peel adhesion of copper coating plated electrolessly on EP resin was improved with a maximum of about 8.1 N/cm.