柔性电子封装技术与应用

Flexible Electronic Packaging Technology and Application

电子封装为芯片提供机械支持、环境保护、电信号引出端和散热通道等重要功能,为了获得较高可靠性,传统封装采用硬质材料体系,难以满足新兴的生物医疗、可穿戴电子、可折叠显示、曲面电子器件等技术领域需求,柔性电子封装颠覆了传统电子系统刚性形态特征,被认为是最有可能实现颠覆性技术创新的领域之一,文中对柔性封装技术及产品的应用领域进行了介绍,并从芯片、基板和封装体三个层面阐述了柔性封装技术的实现方法及面临的挑战,最后,介绍柔性混合电子技术的发展并展望了未来柔性电子技术趋势。

Electronic packaging provides important functions such as mechanical support,environmental protection,electrical signal terminals,and heat dissipation channels for chips.The traditional electronic packaging adopts a rigid material system for high reliability.However,it is difficult to meet the demands of emerging biomedical,wearable electronics,foldable display,curved electronic devices and other technical fields.Flexible electronic packaging subverts the rigid morphological characteristics,and is considered one of the areas with the greatest potential for disruptive technological innovation.The application fields of flexible packaging technology and products are introduced.The realization method and challenges of flexible packaging technology are expounded from the three levels of chip,substrate and packaging.Finally,the development of flexible hybrid electronic technology is introduced and the future technology trend of flexible electronic is forecasted.