改善厚铜连接盘开窗不一致方法研究

Research on the method of improving the inconsistent opening windows of thick copper pad

印制电路板(PCB)贴装连接盘的大小主要由线路蚀刻及阻焊开窗决定。厚铜PCB面铜较厚,蚀刻时无法精准地管控贴装焊盘成品尺寸,且容易变形;另外,阻焊对应偏位也会导致贴装焊盘的大小不一致。通过优化厚铜PCB的线路及阻焊开窗补偿方式,有效地解决贴装焊盘成品尺寸大小不一致的情况。

The size of printed circuit board(PCB)mounting pad is mainly determined by the line etching and solder mask opening window.When the copper pad is thicker on PCB surface,it is impossible to accurately control the size of the finished product of the mounting pad during etching and deformation is particularly easy to appear.Besides,the corresponding deflection of solder mask will also aggravate the inconsistent size of the mounting pad.Through the optimization of the circuit of thick copper PCB and welding optimizing window compensation,the problem of inconsistent size of the finished product of the mounting pad is effectively solved.