摘要
多层印制电路板(PCB)生产过程中,因产品有多样化的设计叠构,造成压合生产过程中多张半固化片(PP)、单张PP叠构产品并行,经常出现尾数,或出现不同的铜厚、PP数量的板件不能满炉压合的情况,直接导致多层压机利用率的降低。在实际生产过程中,如何在保障产品品质的同时,有效地提升多层压机的利用率,显得尤为重要。为此,结合生产的实际情况,通过改变影响压合升温速率的垫层数量,得到适用于不同叠构的产品压合条件,从而达到提升多层压机利用率的目的。
In the production process of multilayer printed circuit board(PCB),due to different application places in the product design,multiple PP and single PP products are often in parallel,or different plate parts of different copper thickness and prepreg(PP)quantity cannot fill the furnace,which directly leads to the reduction of the utilization rate of the press.Therefore,how to effectively improve the efficiency of the press is particularly important.Combined with the actual production situation,by changing the number of cushion layers affecting the heating rate,the product compression conditions suitable for different overlapping structures are obtained,so as to improve the utilization rate of the press.
作者
石邵阳
陈斐健
王富恒
SHI Shaoyang;CHEN Feijian;WANG Fuheng(Meizhou Benchuang Electronics Co.,Ltd.,Meizhou 514000,Guangdong,China)
出处
《印制电路信息》
2023年第10期25-30,共6页
Printed Circuit Information
关键词
牛皮纸
升温速率
多层板压合
kraftpaper
heating rate
multilayer printed circuit board(PCB)pressing