摘要
目的 综述无卤阻燃环氧树脂的最新研究进展,为开发高效阻燃封装材料提供研究思路和技术指导。方法 采用文献调研法介绍无卤阻燃环氧树脂的种类、阻燃机理,总结当前无卤阻燃环氧树脂在电子封装领域的应用现状和技术进展,并对其未来发展趋势进行展望。结果 与本征型无卤阻燃环氧树脂和反应型无卤阻燃环氧树脂相比,填充型无卤阻燃环氧树脂具有工艺简单、种类齐全、性能高效等优点,成为无卤阻燃环氧树脂中应用最广的种类。结论 无卤阻燃环氧树脂能够有效提升电子封装材料的火灾安全性,延长电子器件的使用寿命,促进5G电子器件的高速发展。
The work aims to review the latest research progress of halogen-free flame retardant epoxy and provide research ideas and technical guidance for the development of high efficient flame retardant packaging materials.The types and mechanism of halogen-free flame retardant epoxy were introduced by literature survey,the application status and technical progress of halogen-free flame retardant epoxy in electronic packaging were summarized,and the future devel-opment trend was prospected.Compared with the intrinsic and reactive halogen-free flame retardants,the filled halo-gen-free flame-retardant epoxy had the advantages of simple process,complete variety and high performance,it was the most widely used halogen-free flame retardant epoxy.Halogen-free flame epoxy could effectively enhance the fire safety of electronic packaging materials,extend the service life of electronic devices and promote the rapid development of 5G electronic devices.
作者
于光
郑元丰
YU Guang;ZHENG Yuan-feng(School of Communication,Shenzhen Polytechnic University,Guangdong Shenzhen 518055,China;Zhongshan Torch Polytechnic,Guangdong Zhongshan 528436,China)
出处
《包装工程》
CAS
北大核心
2023年第19期137-148,共12页
Packaging Engineering
基金
广东省普通高校青年创新人才类项目(2021WQNCX229)。
关键词
无卤阻燃
环氧树脂
电子封装
阻燃机理
5G电子
halogen-free flame retardancy
epoxy
electronic packaging
flame retardant mechanism
5G electronic