激光刻痕取向硅钢底层损伤效应研究

Research on surface layer damage behavior of lasers cribed grain-oriented silicon steel

以激光刻痕取向硅钢为研究对象,研究了刻痕过程表面层损伤效应。结果表明,取向硅钢表面层由1.5μm左右的绝缘层、2.5μm左右硅酸镁底层组成,刻痕处理使表面层烧损形成刻线,并在内部形成裸露铁基体和Mg_(2)SiO_(4)的微小孔洞。在刻痕功率较低情况下,刻线为直径50μm的浅轻状断续斑痕,未形成有效刻线。此外,通过提高刻痕功率、降低刻痕频率和速度、增加激光光源能量和作用时间,可使刻线宽度和深度增加,但刻线内部裸露基体和Mg_(2)SiO_(4)的增加以及孔洞密度的增加,不利于产品绝缘性和耐蚀性。

Based on research of laser scribed grain-oriented silicon steel,the surface layer damage behavior of grain-oriented silicon steel was studied in this paper.It is showed that the surface layer of grain-oriented silicon steel was composed of 1.5μm insulation layer and 2.5μm magnesium silicate bottom layer,and the scirbing line with micro-holes composed of bare iron matrix and Mg_(2)SiO_(4)was formed after laser scribing treatment.In case of low scribing power,the scrbing line formed with a light intermittent mark with a diameter of 50μm,and no effective scribing line was formed.In addition,the energy and action time of laser light source increased with the increasing of scribing power and reducing the scribing frequency and speed,but the amount of bare iron matrix and Mg_(2)SiO_(4)and the density of micro-holes inside the scribing line increased,which is harmful to the insulation and corrosion resistance corrosion resistance performance of the product.