大功率LED芯片直接固晶热电制冷器主动散热

Active Heat Dissipation of High-Power LED Chip Directly Bonded on Thermoelectric Cooler

发光二极管(LED)作为新一代绿色固态照明光源,已广泛应用于照明和显示等领域,但散热问题一直是大功率LED封装的关键技术瓶颈。采用大功率LED芯片直接固晶热电制冷器(TEC)的主动散热方法,可增强大功率LED的热耗散,提升大功率LED的发光性能和长期可靠性。利用高精度陶瓷基板和纳米银膏材料制备出高性能TEC,TEC冷端温度最低可达-22.2℃。将LED芯片直接固晶于TEC冷端的陶瓷基板焊盘上,实现LED芯片与TEC的集成封装,制备出LED-TEC主动散热模块。在芯片电流为1.0 A时,由于热电制冷的珀尔帖效应,LED-TEC模块可将LED芯片的工作温度从232℃降低到123℃(降温幅度为109℃),且可使其输出光功率从1087 mW提升到1479 mW,光功率提升幅度达到36.1%。

Light-emitting diode(LED)has been considered as a new generation of green solid-state lighting source,which has been widely used in lighting and display and other fields.However,heat dissipation problem is a key technical bottleneck of high-power LED packaging.An active heat dissipation method of high-power LED chip directly bonded on thermoelectric cooler(TEC)is adopted to enhance the heat dissipation of high-power LED,which can improve the optical performance and long-term reliability of high-power LED.High-performance TECs are prepared by utilizing high-precision ceramic substrates and nano-silver paste materials,and the temperature of the TEC cold-side can reach as low as-22.2℃.The LED chip is directly bonded on the cold-side ceramic substrate of TEC.The LED chip and TEC are integrated and packaged to prepare an LED-TEC active heat dissipation module.At a chip current of 1.0 A,due to the Palter effect of thermoelectric cooling,the LED-TEC module can reduce the operating temperature of LED chips from 232℃to 123℃(decreased by 109℃),and the output light power of LED chips can be increased by 36.1%,from 1087 mW to 1479 mW.