激光软钎焊在微电子焊接领域的应用及发展

Application and development of laser soldering in microelectronic welding

随着现代电子技术的高速发展,微电子焊接领域对工艺可靠性及焊接质量要求相对更高。同时,产品结构精密程度增加、自动化生产要求及加工质量提升给传统微电子焊接工艺带来了更多考验。激光软钎焊作为一种新型微电子连接工艺在很多电子领域已成熟应用,相较于传统工艺方式,其非接触式、精准温控加热的焊接工艺特点在很多工艺场合有着明显优势。本文介绍了激光软钎焊工艺的基本原理,并与传统软钎焊形式进行对比,简单介绍了常见的三种激光软钎焊形式及相关工艺特点,列举了激光软钎焊在不同电子封装领域的应用情况及工艺优势。同时,还介绍了激光软钎焊中典型的焊接缺陷形式和当前激光软钎焊工艺难点。

As the rapid development of modern electronic technology,the higher requirements of process reliability and sol‐dering quality is needed in the field of microelectronic soldering.At the same time,the increase of product structure preci‐sion,the requirements of automatic production and the improvement of processing quality has brought more challenges to the traditional microelectronic welding process.As a new microelectronic connection process,laser soldering has been widely used in many electronic fields.Compared with the traditional soldering process,laser soldering with non-contact,pre‐cise temperature controlled heating process has obvious advantages in many process occasions.This paper introduces the ba‐sic principle of laser soldering and compares it with traditional soldering,briefly introduces three kings of common laser sol‐dering and the process.The application and process advantages of laser soldering in different electronic packaging fields are illustrated.Meanwhile,typical defect forms and current difficulties in laser soldering process are described in this article.