辛基三甲氧基硅烷低聚物对导热胶/垫耐温的影响

Effect of Silane Oligomer on Temperature Resistance of Thermal Conductive Gel/Pad

以辛基三甲氧基硅烷(KH-581)为原料,合成硅烷低聚物DJW-581。通过红外光谱和TGA热重分析仪对合成物进行表征,并通过测试挥发性、改性粉体的挤出性和硬度变化,分析探究硅烷低聚物对有机硅导热凝胶和导热垫片的影响。实验发现硅烷低聚物失重温度为215℃,远高于单体硅烷偶联剂失重温度90℃,更适合作为耐温导热凝胶和垫片的改性助剂。且150℃条件下,硅烷低聚物可使导热凝胶保持长期的挤出性能稳定性,可有效减缓导热垫片老化硬度上升的程度。

A silane oligomer was synthesized from silane coupling agent monomer KH-581.The composite was characterized by infrared spectrum and TGA thermogravimetric analyzer,and the influence of silane oligomer on silicone thermal conductive gel and thermal conductive gasket was analyzed and explored by testing the volatility,the extrudability and hardness changes of modified powder.It was found that the weight loss temperature of silane oligomer was 215℃,which was much higher than that of monomer silane coupling agent by 90℃.It was more suitable to be used as the modifier of temperature resistant and heat conductive gel and gasket.Moreover at 150℃silane oligomer can maintain long-term extrusion stability of thermal conductive gel,which can effectively slow down the aging hardness increase of thermal conductive gasket.