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3D打印调控铜线/聚乳酸复合材料的导热通路长度和数量 被引量:3

Controlled length and number of thermal conduction pathways for copper wire/poly(lactic acid)composites via 3D printing
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摘要 导热通路对理解导热高分子复合材料的导热行为至关重要,但目前有关导热通路属性(长度、数量)对高分子复合材料导热系数的影响机制缺乏深入研究.本文采用3D打印技术制备了铜线(Cw)导热通路长度和数量可控的一维铜线/聚乳酸(1D-Cw/PLA)导热复合材料,建立了针对一维导热通路的高分子复合材料的导热模型,明晰了其导热通路属性与其导热性能的定量关系.相同Cw用量下,1D-Cw/PLA导热复合材料的面内导热系数与导热通路的数量和长度呈正相关.采用本文构建的导热模型和经验方程对1D-Cw/PLA复合材料的导热系数进行预测,95%的置信度表明预测值与实测值无显著差异. Thermal conduction pathways play crucial roles in comprehending thermal transport in thermally conductive polymer composites.However,there is a lack of in-depth investigation on how the thermal conduction pathways(length and number)influence the thermal conductivity coefficients(λ)of the composites.In this work,three-dimensional(3D)printing is performed to fabricate the thermally conductive 1D copper wire/poly(lactic acid)(1D-Cw/PLA)composites,allowing for controlling the length and number of Cw thermal conduction pathways.And one thermal conduction model is also proposed and established for polymer composites with 1D thermal conduction pathways,elucidating the quantitative relationship between thermal conduction pathways and thermal conductivity.For composites with the same amount of Cw,the in-planeλ(λ//)of thermally conductive 1D-Cw/PLA composites is positively correlated with the number and length of Cw thermal conduction pathways.Specifically,when the volume fraction of Cw is 25.1 vol%,the λ//of 1D-Cw/PLA composites,containing 20 intact Cw thermal conduction pathways,can reach up to 4.23 W m^(-1)K^(-1),which is 87.2%higher than that of 1D-Cw/PLA composites without intact Cw thermal conduction pathways(2.26 W m^(-1)K^(-1)),72.0%higher than that of 1D-Cw/PLA composites with short Cw(2 intact Cw and 18 Cw broken at the half,2.46 W m^(-1)K^(-1)),and 1527% higher than that of the pure PLA matrix(0.26 W m^(-1)K^(-1)).Furthermore,the predictedλvalues from our established thermal conduction model and empirical equation show no significant difference from the measuredλat a 95%confidence level.
作者 马腾博 阮坤鹏 郭永强 韩懿鑫 顾军渭 Tengbo Ma;Kunpeng Ruan;Yongqiang Guo;Yixin Han;Junwei Gu(Shaanxi Key Laboratory of Macromolecular Science and Technology,School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi’an 710072,China;School of Chemistry,Beihang University,Beijing 100191,China)
出处 《Science China Materials》 SCIE EI CAS CSCD 2023年第10期4012-4021,共10页 中国科学(材料科学(英文版)
基金 supported by the National Natural Science Foundation of China(51973173) the Technological Base Scientific Research Projects(Highly Thermal conductivity Nonmetal Materials) the Fundamental Research Funds for the Central Universities the Innovation Foundation for Doctor Dissertation of Northwestern Polytechnical University(CX2022073) financially supported by the Polymer Electromagnetic Functional Materials Innovation Team of Shaanxi Sanqin Scholars。
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