低轮廓电解铜箔制备工艺参数的优化

Optimization of process parameters for preparation of low-profile electrolytic copper foil

采用直流电沉积法制备了低轮廓电解铜箔,在仅以明胶作为添加剂的情况下研究了钛基体(阴极)表面粗糙度、电流密度、硫酸质量浓度、铜离子质量浓度、电解液温度等工艺参数对铜箔表面形貌及粗糙度的影响。确定最佳的工艺条件为:钛基体表面粗糙度(Rz)1~2μm,电流密度4.0 A/dm^(2),硫酸100 g/L,铜离子60 g/L,电解液温度37°C。所得铜箔表面形貌良好,粗糙度(Rz)小于1.8μm。

Low-profile electrolytic copper foils were prepared by direct-current electrodeposition with only gelatin as an additive.The effects of some process conditions such as surface roughness of titanium substrate(i.e.cathode),current density,mass concentrations of sulfuric acid and copper ions,and electrolyte temperature on the surface morphology and roughness of the electrodeposited copper foil were studied.The optimal process conditions were determined as follows:surface roughness(Rz)of titanium substrate 1-2μm,current density 4.0 A/dm^(2),sulfuric acid 100 g/L,copper ions 60 g/L,and electrolyte temperature 37℃.The copper foil electrodeposited under the optimized conditions exhibited good surface morphology with a roughness(Rz)of lower than 1.8μm.