铝电解槽热场和流场的测试分析和数值模拟

Test analysis and numerical simulation of thermal field and flow field in aluminum reduction cell

随着电流强度不断增大,铝电解槽产生的热场和流场情况更为复杂,基于COMSOL Multiphysics三维模拟软件,建立热场切片模型和流场整槽模型,对某厂家400 kA铝电解槽的热场和流场进行研究,并通过现场测试数据对比测试结果和模拟结果,验证了该模拟准确性以及该厂家设计合理性。在数值模拟基础上验证了铝电解槽侧部和底部增加纳米材料,铝电解槽最高温度由978℃升至985℃,具有良好的保温效果;并研究了260-310 mm铝液层高度的铝电解槽流场,发现铝液层高度在270-280 mm范围内铝电解槽较稳定。

With the increasing current intensity,the thermal field and flow field generated by the aluminum reduction cell are more complex.Based on the COMSOL Multiphysics 3D simulation software,the thermal field slice model and the flow field full cell model are established.The thermal field and flow field of a 400 kA aluminum reduction cell of a manufacturer are studied.The accuracy of the simulation and the rationality of the manufacturer's design are verified by comparing the test results and simulation results with the field test data.On the basis of numerical simulation,it is verified that nano materials are added to the side and bottom of the aluminum reduction cell,and the maximum temperature of the aluminum reduction cell is from 978 C to 9859C,which shows that the aluminum reduction cell has a good thermal insulation effect.The flow field of the aluminum reduction cell with a height of 260-310 mm aluminum liquid layer is studied,and it is found that the aluminum level is relatively stable within the range of 270-280 mm.