8Vincent J. Ervin,James W. Klett,Chad M. Mundt.Estimation of the thermal conductivity of composites[J]. Journal of Materials Science . 1999 (14)
9Sheila Liza B.Dal.Degradation mechanisms of siloxane-based thermal interface materials under reliability stress conditions. 42ndannual international reliability physics symposium . 2004
10Prabhakumar,et al.Comparison of the adhesionstrength of epoxy and silicone based thermal interface materials. 2003 electronic components and technology conference . 2003