高功率LED彩光模组的散热PCB应用

Thermal Dissipation PCB Application of High Power RGBW LED

基于热电分离式的理念设计并制造出一种金属散热凸台与金属底板一体化的高效导热金属基板。将该散热基板与普通“三明治”结构的单面铜基散热基板对比测试,在金属底板、绝缘层厚度、线路层厚度及布线相同的情况下,驱动同等功率的热电分离式结构LED模组结温更低,辐射通量或光通量更高。实验结果表明,具有热电分离式结构的散热基板较之普通结构的散热基板具有更好的散热能力。

Based on the concept of thermoelectric separation,a kind of metal PCB with high efficiency heat conduction is designed that integrates the thermal pedestal with the metal substrate,and a study is conducted by comparison with the single-sided copper substrate like a common"sandwich"structure.Under the same designed condition of metal base,dielectric thickness and copper thickness as well as same circuit layout,the LED modules with the thermo-electric separation structure have lower junction temperature and higher radiant flux or luminous flux at the same driving power.The test results show that the thermal dissipation substrate with thermoelectric separation structure has better heat dissipation capacity than that with common structure.