铜包覆Ti_(2)AlC增强铜基复合材料的制备及性能

Preparation and properties of Cu-coated Ti_(2)AlC reinforced copper matrix composites

通过化学镀技术在Ti_(2)AlC粉体表面镀上一层金属铜,然后以铜粉、镀铜Ti_(2)AlC粉为原料,采用烧结法制备了10%Ti_(2)AlC/Cu复合材料。结果表明:化学镀铜溶液pH为11~12时,Ti_(2)AlC粉体表面的铜镀层光滑致密、不易脱落。10%Ti_(2)AlC/Cu复合材料的组织分布均匀,镀铜Ti_(2)AlC颗粒与铜基体结合紧密;复合材料相对密度为94.31%,导电性能和硬度相对于纯铜稍有下降;复合材料的平均摩擦系数随着载荷的增加稍微下降,从10 N时的0.4862到30 N时的0.3858,相对于纯铜有明显降低;复合材料的磨损率随着载荷增加逐渐下降,从10 N时的0.208 g·N^(-1)·m^(-1)变为30 N时的0.147 g·N^(-1)·m^(-1)。表明复合材料具有较好的耐磨性。

A layer of metallic copper was deposited on the surface of Ti_(2)AlC powder using electroless plating technology.Then,10%Ti_(2)AlC/Cu composites were prepared by sintering method using copper powder and copper-coated Ti_(2)AlC powder as raw materials.The results show that when the pH value of the electroless copper plating solution is 11-12,the copper coating on the surface of Ti_(2)AlC powder is smooth,dense,and not easy to peel off.The microstructure distribution of the 10%Ti_(2)AlC/Cu composites is uniform,and the coppercoated Ti_(2)AlC particles are tightly bonded to the copper matrix.The relative density of the composites is 94.31%,and the electrical conductivity and hardness slightly decrease compared to pure copper.The average friction coefficient of the composites slightly decreases with the increase of load,from 0.4862 at 10 N to 0.3858 at 30 N,which is significantly lower than that of pure copper.The wear rate of the composites gradually decreases with increasing load,from 0.208 g·N^(-1)·m^(-1) at 10 N to 0.147 g·N^(-1)·m^(-1) at 30 N,which indicates that the composites have good wear resistance.