SoC芯片可测试性设计策略分析

Analysis of testability design strategy for SoC chips

微电子器件已经广泛应用于航空航天等多个领域中,发挥着重要作用。随着芯片技术的升级,集成电路不断缩小尺寸,系统级芯片(SoC)已经得到广泛应用,且对于SoC芯片需求量逐渐增多。基于此,文章通过分析SoC芯片结构,进一步研究可测试性设计,以阐述测试性能控制方法,实现性能和效率的优化。在测试中利用芯片功能模块接口和外部端口存在的映射关系,通过锁存器和JTAG进行控制。通过可测试性设计能够缩短测试时间,降低测试成本,支持芯片质量和成本效益的提高。

Microelectronic devices have been widely used in various fields such as aviation and aerospace,playing an important role.With the upgrading of chip technology and the continuous reduction of integrated circuits,system level chips(SoCs)have been widely used,and the demand for SoC chips is gradually increasing.Based on this,this article further studies testability design by analyzing the structure of SoC chips,in order to elaborate on testing performance control methods and achieve optimization of performance and efficiency.During testing,the mapping relationship between the chip functional module interface and external ports is utilized to control through latches and JTAG.Design for testability can shorten testing time,reduce testing costs,and support the improvement of chip quality and cost-effectiveness.