基于红外成像的缺陷复合绝缘子温升特性分析

Analysis of temperature rise characteristics of defective composite insulators based on infrared imaging

基于生产实际,通首至尾地对芯棒-护套气隙、芯棒内部气隙及工艺铁屑内部残留的3类复合绝缘子缺陷进行模拟,搭建高压试验平台对缺陷处进行激发使其产生温升,利用红外检测设备得到复合绝缘子的红外图像,分析不同缺陷类型下的温升特性。结果表明,3种缺陷绝缘子均存在温升现象,但发热现象有所差别,其中工艺铁屑内部残留缺陷温升达到4.5 K,发热区域自金具附近延伸至后两伞裙处,发热现象明显;湿度是影响温升的重要因素,湿度增加35%时芯棒内部缺陷的温升幅值增加73.67%。研究结果可为复合绝缘子内部缺陷红外检测及诊断提供参考。

In this paper,the defects in three types of composite insulators,namely,core sheath air gap defect,core internal air gap defect and process iron chip internal residual defect,were fabricated manually in the laboratory.High voltage test platform and conduct test.Obtain infrared image of composite insulator using infrared detection equipment.The research shows that the temperature rise of three artificial defect insulators exists.The temperature rise of residual defects in process iron filings reaches 4.5 K,and the heating area extends from near the fittings to two umbrella skirts.When the humidity increases by about 35%,the temperature rise amplitude of the internal defects of the mandrel increases by 73.67%.The research results can provide reference for infrared detection of internal defects of composite insulators on site.