微波组件绝缘子与微带线连接故障分析及改进

Analysis and Improvement of Connection Fault between Microwave Module Insulator and Microstrip Line

某型微波组件射频绝缘子与外部微带线采用焊锡直接焊接方式,在产品试验验证阶段出现了绝缘子与外部微带线的连接故障。先对故障现象进行分析判断,再利用有限元仿真软件比较焊锡焊接(硬连接)和铜带搭焊(软连接方式之一)在温度循环载荷下的应力情况,从而获得最优化的连接方式;最后在产品上使用铜带搭焊方式进行试验验证和技术指标仿真验证,验证结果证明铜带搭焊方式可靠。研究结果可为同类产品中绝缘子和微带线互联提供了一定的参考。

A certain type of microwave module RF insulator and external microstrip line were directly soldered,and during the product testing and verifi cation,there was a connection failure between the insulator and the external microstrip line.The fault phenomenon is analyzed and judged,and then the fi nite element simulation software is used to compare the stress conditions of solder welding(hard joint)and copper strip lap welding(soft joint)under cyclic temperature load,in order to obtain the optimal connection mode.Finally,the copper strip lap welding method is used on the product to test and verify the technical index simulation.The verifi cation results show that the copper strip lap welding method is reliable.The research results can provide some reference for the interconnection of insulators and microstrip lines in similar products.