高性能铜基复合材料研究进展

Research progress of high performance copper matrix composites

铜和铜合金凭借其高导电性、导热性、易加工性和耐腐蚀等特性被广泛应用于电接触材料、电子封装材料、热交换材料等领域,然而铜合金强化过程中强度和电导率、热导率之间此消彼长的矛盾使其发展受限。铜基复合材料可通过强化相提升材料的强度,并且可避免对铜基体产生严重晶格畸变,最大化保证材料的电导率,从而获得优异强阻比的材料,因此铜基复合材料是高性能铜材的一个重要发展方向。本文概述了高性能铜基复合材料的主要制备方法,总结了复合材料增强相及其特点和发展方向。阐述了主要研究进展及其在轨道交通、电工电子、军工方面的应用现状,并对该材料未来的发展方向进行了展望,为高性能铜基复合材料的研究和应用提供参考。

Copper and copper alloys are widely used in electrical contact materials,electronic packaging materials,heat exchange materials and other fields because of their high electrical conductivity,thermal conductivity,easy machinability and corrosion resistance.However,the contradiction between strength,electrical conductivity and thermal conductivity in copper alloys limits its development.Copper matrix composites can improve the strength of materials by strengthening phase,avoid serious lattice distortion to copper matrix,and maximize the conductivity of materials,thus obtaining materials with excellent strength-resistance ratio.Therefore,copper matrix composites are an important development direction of high performance copper materials.In this paper,the main preparation methods of high performance copper matrix composites are summarized,and the reinforcing phase of composites,its characteristics and development direction are summarized.The main research progress and its application status in rail transit,electrics and electronics,military industry are described,and the future development direction of this material is prospected,which provides reference for the research and application of high performance copper matrix composites.