黏结剂与塑化剂含量对YSZ流延膜带制备及陶瓷电学性能的影响

Effect of Binder and Plasticizer Content on Performances of YSZ Tape and Electrical Properties of YSZ Ceramics

在高温共烧陶瓷(HTCC)工艺制备厚膜陶瓷器件的过程中,流延添加剂(黏结剂与塑化剂)是影响陶瓷性能的重要因素之一。系统地研究了添加剂含量对钇稳定氧化锆(YSZ)流延浆料黏度、膜带厚度及陶瓷的收缩率、相对密度、电导率及机械强度的影响。结果表明:添加剂含量的增加会使流延浆料黏度上升、膜带厚度下降,烧结过程中陶瓷线收缩率与热失重增大,烧结后的陶瓷密度降低,导致了其抗弯曲强度及电导率的下降,氧离子迁移活化能则随之增大。当添加剂质量分数为12 wt.%时,YSZ陶瓷的相对密度最高达到98.95%,此时陶瓷电导率最高,活化能最低(0.9456 eV)。

In the process of preparing thick film ceramic devices through high temperature co-fired ceramics(HTCC)technology,the addition of casting additives(binders and plasticizers)plays a critical role in determining the performance of the final ceramics.The effects of additive content on key properties of yttria-stabilized zirconia(YSZ),including slurry viscosity,film thickness,shrinkage rate,relative density,electrical conductivity and mechanical strength of the sintered ceramics,were systematically studied.It is revealed that an increase in additive content leads to an increase in slurry viscosity and a decrease in film thickness.During sintering,both shrinkage rate and thermal weight loss of the ceramic increase with increasing additive content.In particular,density of the sintered ceramics decreases as the mass fraction of additives increases.Compared with the low-additive content samples,the sintered ceramics exhibit a significantly lower flexural strength and electrical conductivity.Meanwhile,there is an increase in the activation energy of oxygen ion migration.Moreover,relative density of the YSZ ceramics reaches a maximum value of 98.95%when the mass fraction of casting additives is 12%.At this optimally formulated state,the ceramics exhibit the highest conductivity,while the activation energy reaches the lowest recorded level of 0.9456 eV.Our study provides valuable insights into the role of casting additives in defining the properties of YSZ ceramics,which may help manufactures develop effective formulation and processing strategies to optimize the performance of thick film ceramic devices.