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单晶锗超精密切削表面粗糙度工艺优化与试验研究 被引量:1

Process Optimization and Experimental Research on Surface Roughness of Single-Crystal Germanium for Ultra-Precision Cutting
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摘要 为了提高单点金刚切削单晶锗的表面质量,进行了三因素四水平的正交试验,并采用方差分析和极差分析,研究了在单晶锗表面质量分布不均匀条件下表面粗糙度受切削参数的影响。试验结果显示:主轴转速对表面粗糙度值影响明显,而且贡献率最高,主轴转速越大,则表面粗糙度值也越小。获得的最优切削参数组合为主轴转速为3800 r/min、进给速率为2 mm/min、最大切削深度为5μm。在此切削条件下得到了表面粗糙度为2.4 nm的高精度单晶锗,在扫描电镜下观察其表面质量较好,且表面也比较平滑,切削过程中的切屑呈带状,材料在塑性范围内去除。 In order to improve the surface quality of single-point diamond cutting single-crystal germanium,the orthogonal experiment of three factors and four levels is carried out,and the effect of cutting parameters on the surface roughness under the condition of uneven surface quality distribution of single-crystal germanium is studied by variance analysis and range analysis.The test results show that the contribution rate is the highest when the spindle speed has obvious influence on the surface roughness value,indicating that the larger the spindle speed is,the smaller the surface roughness value is.As a result,an optimal combination of the cutting parameters obtained is that a spindle speed of 3800 r/min,feed rate of 2 mm/min,and maximum cutting depth of 5 μm.Under this cutting condition,high-precision single-crystal germanium with a surface roughness of 2.4 nm is obtained.Next,the surface quality is good and the surface is relatively smooth according to the scanning electron microscope.The chips during cutting are banded,and the material is removed in the plastic range.
作者 程铂涵 杨晓京 郭彦军 姚同 康杰 Cheng Bohan;Yang Xiaojing;Guo Yanjun;Yao Tong;Kang Jie(Faculty of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,Yunnan,China;Yunnan KIRO Photonics Co.,Ltd.,Kunming 650217,Yunnan,China)
出处 《激光与光电子学进展》 CSCD 北大核心 2023年第19期156-162,共7页 Laser & Optoelectronics Progress
关键词 材料 单晶锗 单点金刚切削 切削参数 表面粗糙度 materials single-crystal germanium single-point diamond cutting cutting parameters surface roughness
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  • 1姜峰,李剑峰,孙杰,李方义,路冬.硬脆材料塑性加工技术的研究现状[J].工具技术,2007,41(8):3-8. 被引量:21
  • 2王景贺,陈明君,董申,张龙江.KDP晶体单点金刚石切削脆塑转变机理的研究[J].光电工程,2005,32(7):67-70. 被引量:21
  • 3王先奎.精密加工技术实用手册[M].北京:机械工业出版社,2001..
  • 4文绣兰,林宋,谭昕,等.超精密加工技术与设备[M].北京:化学工业出版社,2006.
  • 5张曾扬,吕红捷,鲍跃光,等.现代光学制造技术文集[C].北京:中国兵工学会光学学会,2002.
  • 6F·M·斯坦斯菲尔德.静压支承在机床上的应用[M].北京:机械工业出版社,1978.
  • 7殷育平,娄锐,赵学东,等.数控机床[M].北京:机械工业出版社,1997.
  • 8[1]T Nakasuji,S Kodera et al.Diamond turning of brittle materials for optical components.Annals of the CIRP,1990,39(1):89~92
  • 9[2]Peter N Blackey,Ronald O Scattergood.Ductile-regime machining of germanium and silicon.J.Am.Ceram.Soc.,1990,73(4):949~957
  • 10[3]B R Lawn,A G Evans.A model for crack initiation in elastic/plastic indentation fields.Journal of Materials Science,1977(12):2195~2199

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