PCB阻焊剂低压喷涂均匀性提升研究

Research on improving the solder mask uniformity by low⁃pressure spraying on PCB

主要针对印制电路板(PCB)阻焊层常用的低压喷涂机进行设计试验测试,确定适用于线面阻焊油墨厚度在10~30μm范围内的可加工工艺参数。提升了低压喷涂过程中的均匀性,同时提高了工艺的可控性和一致性。

This study aims to conduct design experiments and tests for the low-pressure spraying machine commonly used in the printed circuit board industry to determine the process parameters that are applicable to the thickness of the solder mask in the range of 10-30μm.Through research,we successfully improve the uniformity of low-pressure spraying processes,and improve the controllability and consistency of the process.