摘要
通过有限元仿真软件AnsysWorkbench分析印制电路板组件(PCBA)表面球栅阵列封装(BGA)器件焊点在电迁移条件下温度场、电场、应力场的分布情况并提取相关参数,确定在电迁移条件下危险焊点的位置。利用理论公共法,计算危险焊点的电迁移散度、迁移力等关键参数。采用生死单元法模拟空洞的动态形成过程,对BGA器件危险焊点的电迁移寿命进行计算,对照仿真结果开展寿命试验,验证了仿真寿命的有效性。
The distributions of temperature field,electric field and stress field of ball grid array(BGA)device solder joint under electromigration condition are analyzed by Ansys Workbench,and the relevant parameters are extracted to determine the location of dangerous solder joint under electromigration condition.Then the key parameters of dangerous solder joint,such as electromigration divergence and migration force,are calculated by using the common theoretical method.The brith and death element is used to simulate the dynamic formation process of solder joint voids,and the life of dangerous solder joints of BGA devices is calculated.The life test is carried out to verify the effectiveness of the simulation life.
作者
陈帅
赵文忠
张飞
赵志平
CHEN Shuai;ZHAO Wenzhong;ZHANG Fei;ZHAO Zhiping(The 20th Research Institute of CETC,Xi'an 710071,Shaanxi,China)
出处
《印制电路信息》
2023年第11期51-57,共7页
Printed Circuit Information
关键词
表面安装技术
电迁移
危险焊点
仿真寿命
surface mounted technology(SMT)
electromigration
dangerous solder joints
simulation life
